Effect of solvent type on microencapsulation of 1-methylimidazole curing agent by solid epoxy shell

In this study, 1-methylimidazole was microencapsulated by using solid epoxy resin via solvent evaporation method. Two solvents by different polarity were used to investigate the effect of solvent type on encapsulation of 1-methylimidazole curing agent. Thermal gravimetric analysis (TGA) method was used for calculation of the core content and microencapsulation efficiency. SEM investigation of fractured surface of microcapsules showed mono core morphology.

کلیدواژه ها:

1-methylimidazole ، Microencapsulation ، Epoxy resin ، Solid epoxy shell ، Curing agent