Numerical Analysis of Baffle Placement in Two Dimensional Microchannel Heat Exchangers for Enhanced Electronic Chip Cooling

The rapid advancement of compact and high-power electronic devices has led to a growing need for efficient thermal management techniques that ensure device stability and performance. Microchannel heat exchangers (MCHEs) have emerged as one of the most promising solutions due to their high surface-to-volume ratio and ability to achieve high heat transfer rates. Among various enhancement strategies, the incorporation of baffles within the flow domain is known to intensify mixing, reduce thermal boundary layer thickness, and improve convective heat transfer. In this study, a numerical investigation was conducted to analyze the effect of different baffles placements inside a two-dimensional microchannel heat exchanger intended for electronic chip cooling. The simulations were carried out using COMSOL Multiphysics under laminar flow conditions with Reynolds numbers of ۶۰۰ and ۱۸۰۰. Three configurations of baffles placement were explored to evaluate their impact on velocity distribution, pressure drop, and temperature profiles. The findings revealed that optimized baffles positioning leads to significant enhancement in thermal performance, with Case ۱ and Case ۳ showing the best results in terms of heat transfer and overall thermohydraulic efficiency. Specifically, convective heat transfer coefficients improved by up to ۲۳۱% compared to the base model without baffles. The Pressure Drop versus Heat Transfer ratio was also analyzed to identify the most energy-efficient setup under various flow regimes. This research contributes to the growing body of knowledge in electronic thermal management by offering a simple yet effective microchannel design modification that improves To dissipate the surface heat without requiring complex geometries or active cooling methods. The outcomes are especially valuable for passive cooling solutions in miniaturized devices such as CPUs, GPUs, and power electronics.

کلیدواژه ها:

Microchannel heat exchanger ، baffles ، Electronic chip cooling ، Passive cooling ، Thermal management