Microstructural evolution in nano grained copper produced by ARB process

Accumulative roll bonding (ARB) process is a severe plastic deformation (SPD) process that has been used for pure copper. The ARB process up to 8 cycles was performed at ambient temperature. Microstructural characterizations were done by TEM and EBSD. It was found that grain subdivision and continuous recrystallization resulted in microstructure covered with recrystallized nano grains with an average diameter below 100nm

کلیدواژه ها:

Accumulative roll bonding ، Severe plastic deformation ، Pure copper