The Effect of Partial Brazing (PB) on microstructure and properties of a copperberylium alloy

A Copper Beryllium alloy was partial brazing (PB) bonded using different foil under argon and vacuum atmospheres for various hold times and temperature. In this study, we attempted to explain the joining mechanism by means of the results of the X-ray analysis and the observation of the joining process. Mechanical properties of joints were measured though microhardness, tensile strength and fatigue tests. The mechanical properties of PB bonds made under vacuum were higher than those of bonds made under argon atmosphere. The microstructures and fracture surfaces were studied using optical and scanning electron microscopy. The poor mechanical properties of bonds made under argon atmosphere were related to the formation of voids and porosities within the bond region during bonding cycle. Microstructure studies showed intermetallic compounds within the joint region. The shorter time cycle would lead to increase tensile and fatigue strength of lap joints. Microscoopie examination. Of joint interfaces showed a uniform structure from both solid and intermetallic compounds that resulted from optimum brazing condition.

کلیدواژه ها:

Copper Berylium a lloy ، PB bonding ، Aging