Surveying the Adhesive Interaction on the Laminated Particleboard

Adhesives are used in many different applications with wood products same asparticleboard (PB). In this work, the curing reaction of system consisting of some adhesive sameas urea formaldehyde (UF), urea-melamine formaldehyde (MUF) and epoxy was studied indifferent ratios by using FTIR and non-isothermal DSC techniques. Compared to other woodadhesives, such as phenol-formaldehyde (PF) or diphenyl methane di-isocyanate, UF resinpossesses some advantages such as fast curing, good performance in the panel, water solubilityand lower price. From the infrared spectra using a peak-height method, which was based on theratio of the height of the characteristic to reference absorbance peak, degree of conversion atdifferent temperature were calculated. FTIR measurements showed decrease in the intensity ofthe absorption band of epoxide group at 916 cm-1 during curing process. At all temperature, thedegree of conversation increased when the intensity of the band at 916 cm-1 decreased.The rate of epoxide conversion depends on the weight ratio of adhesives and also on thetemperature of cure reaction. In general, the results obtained from isothermal DSC experimentsshowed that the rate of reaction is proportional to the heat flow. A higher isothermal temperatureand higher urea formaldehyde concentration led to increase in the reaction rate.

کلیدواژه ها:

Curing Reaction ، PB ، DSC Analysis ، FTIR ، Adhesive