Experimental investigation of the thermal performance of impinging jet cooling in electronic component cooling

Fluid impingement jet cooling is considered a suitable solution for the thermal management of electronic components such as microprocessors with high production heat fluxes, to prevent damage and malfunction of these types of equipment. In this experimental research, the effective factors on the performance of an impinging jet cooling device with dual surface side exits were investigated experimentally. With the help of the Taguchi optimization method, the effects of the jet nozzle diameter and its height from the cooling surface at the same flow rate and water-ethylene glycol joint fluid in three different heat fluxes were investigated in this set-up, and the most optimal operating mode of the device was seen the results collected by several thermocouples were presented as stable temperatures of the cooling surface and fluid. The obtained results showed that the way the fluid flow exits can play a role in the influence of the mentioned parameters.

کلیدواژه ها:

Cooling of electronic components ، Fluid impingement jet ، Taguchi optimization ، Surface side exits ، Microprocessors