Microstructure and mechanical properties of TLP bonded a low C–Mn steel using copper interlayer with different thickness

سال انتشار: 1395
نوع سند: مقاله کنفرانسی
زبان: انگلیسی
مشاهده: 360

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شناسه ملی سند علمی:

INCWI17_076

تاریخ نمایه سازی: 9 آذر 1398

چکیده مقاله:

Transient liquid phase bonding was used to join a low-carbon manganese steel (st52) at 1423K (1150C) with copper interlayers of 10, 30 and 50μm thicknesses. Microstructure studies indicated that isothermal solidification completion time decreased with decreasing interlayer thickness. Bonded samples that achieved completed isothermal solidification were homogenized at 1003K (730C) for 75 minutes and then quenched into cold water to assess final-bond microstructure and strength. This heat-treatment cycle resulted in transformation of both the parent alloy and joint region into ferrite-martensite dual-phase microstructure.Mechanical tests showed that the joint micro-hardness is greater than the parent alloy in both homogenized and un-homogenized bonded samples. Shear strength tests results showed that the shear strength of homogenized bonded samples increased a little with increasing the interlayer thickness. These differences were related to microstructure and distribution of alloying elements within the joint and parent alloy

نویسندگان

A.H Zahiri

Department of Materials Science and Engineering, Sharif University of Technology, P.O. Box ۱۱۳۶۵-۹۴۶۶, Tehran, Iran

A. Ekrami

Department of Materials Science and Engineering, Sharif University of Technology, P.O. Box ۱۱۳۶۵-۹۴۶۶, Tehran, Iran