NUMERICAL SIMULATION OF ASPHALT BINDER BLISTER TEST

The finite element computer program ANSYS (Ver.15.0) used to simulate the bonding strength between asphalt and aggregate in the blister test. The height of asphalt blister (air bubble within the asphaltlayer) is calculated. The height of asphalt binder is analyzed when the thin film of asphalt binder begins to displacement from aggregate substrate (aggregate disc) .In order to simulate the behavior of bondingstrength between substrate (aggregate disc) and adhesive layer (thin film asphalt binder), a linear finite element analysis has been carried out to analysis all adopted models. Three models of substrate –adhesive layerwere used in this study to explain the adhesion and bond strength between aggregate disc and thin film asphalt binder and calculation the interfacial fracture energy required to displacement asphalt fromaggregate disc by applied air pressure at interface between them. Three thickness of thin film asphalt binder that used in these models. The accuracy of the finite element models is determined by compression theresults of displacement obtained from ANSYS (ver.15.0) program with results of experimental work. The results of simulation show a good agreement with the experimental result.

کلیدواژه ها:

Blister test ، Interfacial fracture ، Thin film ، Aggregate substrate ، Bonding strength ، Coefficient of thermal expansion