Effects of Abrasive Particle Characteristics on the Impact Behavior of Single Crystal Silicon Using hybrid "MD-FEA" Simulation

Development of new techniques for prediction of materials behavior in sub macro scales has been an area of ongoing focus for many researches. Interest in this topic has been increasing over the past decade due to the trend towards higher accuracy as well as smaller-sized components. The challenge here is the changes in material properties and their behavior in different scales. It is impractical to use macro methods at micro and nano levels. This paper introduces a novel methodology of extracting material properties from molecular dynamics simulation and utilizing them in finite element analysis. By using this new approach, the impact behavior of single crystal silicon wafer was simulated and the effects of abrasive particle characteristics such as their initial velocity and diameter were investigated. Findings from this study can be used in planning experimental studies on micro-and nano-machining procedures.

کلیدواژه ها:

Impact ، Molecular Dynamics ، Finite Element ، Uniaxial tension test ، Silicon