Dielectric and Thermal Behaviour Analysis of Epoxy Composites Filled with Date Seed Particles Using Finite Element Method

This study reports the thermal and dielectric behaviours of epoxy composites filled with date seed particles. DSP-epoxy composites are fabricated by adding date seed powder into epoxy resin at varying weight (۰-۲۵ %) and volume (۰-۱۷.۹۵ %) fractions using a hand layup technique. The thermal conductivity of the composites is measured by UnithermTM۲۰۲۲ and HIOKI-۳۵۳۲-۵۰ Hi Tester ElsierAnalyzer determines the dielectric constant. The finite element method (FEM) using Digimat FE software is used to simulate the thermal conductivity of the DSP-epoxy composites. The result showed that the thermal conductivity of the epoxy reduced by ۲۷ % from ۰.۳۶۲ W/ m-K to ۰.۲۶۱ W/ m-K with the addition of ۱۷.۹۵ vol. % of DSP. The FEM-predicted values are found to be closest to the measured values, with an error range of ۶-۱۰%. The dielectric constant of the composites increased with the addition of DSP content across all frequency ranges due to interfacial and dipolar polarization. However, the dielectric constant decreased at high frequencies due to a lag in dipole orientation.

کلیدواژه ها:

Epoxy composites ، Date seed particle ، Thermal characterization ، conductivity ، Dielectric constant