Characterization of Stability Region and Sensitivity Analysis for Electrospray Cooling with Hemispherical Nozzle

In the quest for advanced thermal management in high-power electronic devices, electrospray cooling has emerged as a promising alternative to conventional methods. The study investigates the impact of key electrohydrodynamic parameters—namely, volumetric flow rate, applied voltage, electrode geometry, and nozzle-to-ring distance—on the system’s critical heat flux (CHF) and overall thermal performance. A Taguchi L۱۶ orthogonal array design was employed to systematically explore the parameter space while reducing experimental complexity. High-speed imaging and electrical resistance measurements were used to delineate the stability region of the electrospray process, focusing on the transition from a stable cone-jet mode to a multi-jet mode. Results indicate that the volumetric flow rate is the predominant factor influencing CHF, as it directly governs the energy required for fluid evaporation in the nucleate boiling regime. Moreover, modifications in electrode spacing and applied voltage significantly alter the electric field distribution, thereby enhancing droplet atomization and spray coverage. These insights are instrumental for optimizing electrospray cooling configurations and advancing thermal management strategies for next-generation electronic devices.

کلیدواژه ها:

Electrospray ، Heat Transfer ، Stability Region ، Sensitivity Analysis ، Cone-Jet Mode