Evaporative Cooling through Superhydrophilic Surface Structuring for Thermal Management

Effective thermal management is essential for advancing high-performance electronics, as overheating limits processing speed, miniaturization, and reliability. Conventional aluminum heat sinks (CHS) struggle to dissipate heat effectively in electronic systems. This study introduces a surface-engineered, evaporative heat sink (EVHS) to improve cooling performance. Chemical etching created superhydrophilic micro/nanostructures on aluminum fins, promoting water spreading and capillary-driven evaporation. When integrated with capillary-fed water delivery, the modified heat sink increased the voltage output of a thermoelectric module (TEM) by ۲۱%, indicating superior heat dissipation over CHS. In dry conditions, roughened surfaces showed only minor improvements (~۲%). Surface characterization using SEM confirmed the successful formation of micro/nanostructures to achieve a suitable roughened surface. This passive, scalable strategy enhances cooling efficiency and holds promise for next-generation electronic applications.

کلیدواژه ها:

Superhydrophilic ، heat sink ، evaporative cooling ، thermoelectric module