Preparation of a Semiconductor Acrylic Pressure-Sensitive Adhesive UsingSurface-Modified Copper Nanoparticles

Despite the importance of using semiconductor pressure-sensitive adhesives (PSAs) in electronicapplications, their development is limited due to several complexities. In this research, the surface ofcopper nanoparticles was modified using ۳-methacryloxypropyltrimethoxysilane and confirmed byFourier Transform Infrared Spectroscopy. These surface-modified copper nanoparticles weresolution mixed with a solution polymerized acrylic PSA at a content of ۵ wt. % with respect to thePSA total solid content. The completely smooth and homogeneous surface of the dried film of thePSA mixture revealed the suitable dispersion and distribution of the surface-modified coppernanoparticles in the PSA. The addition of these nanoparticles to the PSA led to about ۶-foldimprovement in the electrical conductivity of the pure acrylic PSA in the range of semiconductormaterials.

کلیدواژه ها:

Adhesive ، Acrylic Copolymer ، Copper Nanoparticle ، Electrical Conductivity ، Semiconductor.