Encapsulation of ۱-methylimidazole as curing agent of epoxy resin andevaluation of it’s release behaviour

سال انتشار: 1403
نوع سند: مقاله کنفرانسی
زبان: انگلیسی
مشاهده: 51

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شناسه ملی سند علمی:

ISPST16_125

تاریخ نمایه سازی: 10 آبان 1403

چکیده مقاله:

In order to prepare the epoxy resin of the thermal delay curing system, an efficient and economicstrategy for rapid microcapsation of imidazole-based agents was developed through the click reactionof a bismaleimide (BMI) resin and a tetrathiol (SH) within oil/water emulsion systems. The successfulformation of the fully cross-linked BMI shell was confirmed by Fourier transform infrared (FT-IR)spectra, showing relatively full conversions of monomers. Optical microscopy images showed a coreshellstructure with spherical morpholegy for microcapsoules in the range of ۲۰-۱۰۰ μm. Releasebehaviour of the curing agent from microcapsoules was evaluated using UV-Vis spectroscopy andthe results showed that absorption intensity was increased with increasing temperature above theglass transition temperature of shell

نویسندگان

S. Hajebi

Polymer Engineering Division, Department of Polymer Engineering, Faculty of Material and ManufacturingTechnologies, Malek Ashtar University of Technology, Tehran, Iran

H. Fattahi

Polymer Engineering Division, Department of Polymer Engineering, Faculty of Material and ManufacturingTechnologies, Malek Ashtar University of Technology, Tehran, Iran

M. Mortezaei

Polymer Engineering Division, Department of Polymer Engineering, Faculty of Material and ManufacturingTechnologies, Malek Ashtar University of Technology, Tehran, Iran

H. Heidarnezhad

Polymer Engineering Division, Department of Polymer Engineering, Faculty of Material and ManufacturingTechnologies, Malek Ashtar University of Technology, Tehran, Iran