Study of Nonisothermal Cure kinetics of Epoxy-based Nanocomposites by Differential Scanning Calorimetry

Epoxy resins are the most important class thermoset resins that have various applications in polymer composits, adhesives, coating, dielectric materials, electronic component and aerospace product. These advanced applications demand outstanding material properties of the epoxy resins that are predetermined by the chemical structure of the resin and hardener, as well as by the network achieved after curing [1-2]. Industrial applications require a complex property profile of the reacting and cured epoxy resin. Almost all resins modified with various additives and fillers show improvement in processability, mechanical, thermal and electrical properties in the cured state [3-5]. An inorganic nanoparticle is as excellent toughening and reinforcing material to develop new nanocomposites. It is well known that the structure and properties of a polymer are greatly different from those of inorganic nanoparticles [4]. Due to the functional groups of the modifier the inorganic nanoparticle may be incorporated into the organic network of the cured resin [6]. Cure kinetics of epoxy resin can be studied by different techniques, such as Differential Scanning Calorimetry (DSC) and infrared spectroscopy (IR). Understanding the curing of thermosetting systems is important for their use in structural composites, reaction injection modeling and electronic applications [7, 8]. In this study the Isoconversional analysis has been applied to nonisothermal DSC data on the epoxy-based Nanocomposites cure

کلیدواژه ها:

Epoxy resin ، Kinetics ، DSC ، Nano TiO2/SiO2