non linear finite element modeling of nanoindentation to simulate contact behavior in film -substrate interface

in recent years the nanoindentation techniques have been used to determine the hardness and youngs modulus o fthin films nanoindentation is playing an increasing role in study of small scale mechanical behavior of the soft materials such as polymers composites biomaterials and food products the technique increases the applicability of indentation testing to the tiny layers composite layers and modulated compositions multi layered and composite systems which often contain metal/ceramic interfaces are widely used inmicroelectronic packaging and also as structural materials the materials used to design each microdevice depend on the operational environment and devices functionality.