Investigation of thermal behavior of epoxy coatings containing surface-modified hollow glass microspheres

In this study, a coating based on epoxy resin containing surface-modified hollow glass microspheres (HGM)(۵, ۷, and ۱۰% w/w) has been used as a thermal insulation composite. The surface of the hollow glass microspheres ismodified with an appropriate amount of silane coupling agent (Amino propyl tri ethoxy silane). The thermalconductivity of the coatings was measured with a temperature-modulated scanning differential calorimeter (TMDSC).The effects of HGMs concentration and surface modification on the thermal and mechanical properties of coatingshave been investigated. It was found that the coating containing ۵% by weight of modified HGMs has optimalproperties compared to other coatings. The coefficient of thermal conductivity in the optimal value has decreased to۲۶% compared to blank epoxy and has reached ۰.۱۶ w/m.k.

کلیدواژه ها:

Hollow glass microspheres ، Thermal insulation coatings ، Thermal conductivity coefficient ، TMDSC