Numerical investigating the gas slip flow in the microchannel heat sink using different materials

سال انتشار: 1397
نوع سند: مقاله ژورنالی
زبان: انگلیسی
مشاهده: 134

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شناسه ملی سند علمی:

JR_CHAL-6-0_007

تاریخ نمایه سازی: 1 مرداد 1401

چکیده مقاله:

In this work, slip flow of helium gas has been studied in a three dimensional rectangular microchannel heat sink with ۱۱ microchannel and ۱۰ rectangular fins. Helium gas flow is considered ideal and incompressible. The finite volume method with using coupled algorithm is employed to carry out the computation. To validate the present work, comparison with numerical and experimental studies is done and it is seen that the computed results have good agreement. To investigate the effect of fins and walls material on heat sink performance, all simulations are carried out and compared with each other for three materials consisting of aluminum, silicon and copper. The results show that along the microchannel, local Knudsen number decreases. Also thermal resistance increases continuously with increasing Knudsen number from ۰.۰۰۶ to ۰.۰۴۸. The results indicate that for various inlet Knudsen numbers, copper heat sink has the lowest thermal resistance. Furthermore, copper heat sink has the highest average Nusselt number for Knudsen number higher than ۰.۰۲۴ but for Knudsen number lower than ۰.۰۲۴, silicon heat sink has higher average Nusselt number than copper heat sink.

نویسندگان

Mojtaba Sepehrnia

Department of Mechanical Engineering, Shahabdanesh University, Qom, Iran

AhmadReza Rahmati

university of kashan