Microstructure / Physical properties investigation in lead free solder reinforced with graphene nanosheets (SAC۰۳۰۷+GNSs)

  • سال انتشار: 1400
  • محل انتشار: چهارمین کنفرانس بین المللی جوشکاری و آزمایش های غیرمخرب و بیست و دومین کنفرانس ملی جوش و بازرسی و یازدهمین کنفرانس ملی آزمایش های غیرمخرب
  • کد COI اختصاصی: INCWI22_124
  • زبان مقاله: انگلیسی
  • تعداد مشاهده: 104
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نویسندگان

Sajjad Azghandi Rad

Master degree, Department of material science and engineering, IRAN

Mojtaba Movahedi

Associate professor, Department of material science and engineering, IRAN

Amirhossein Kokabi

Professor, Department of material science and engineering, IRAN

Moein Tamizi

PHD student, Department of material science and engineering, IRAN

چکیده

Development of electronic industries, compression of electronic equipment, and removing lead from electronic circuits for environmental issues, resulted in a significant challenge in design and development of tin-based lead-free solders with physical and mechanical properties similar to old tin-lead alloys. In this regard, the set of Sn-Ag-Cu alloys with eutectic and near eutectic compositions have been proposed to replace Sn-Pb solders. As a lead-free solder alloy, low melting point, high reliability, and compatibility with various fluxes are among the properties of this category of alloys. In order to improve the properties of the joint, these solders are sometimes reinforced with different nanoparticles. In this study, Sn۰.۳Ag۰.۷Cu compound reinforced with graphene nanosheets with different weight percentages (۰, ۰.۰۵, ۰.۱, and ۰.۲) was studied. Microstructure of the alloys was investigated by scanning electron microscopy(SEM) andoptical microscopy. Melting temperature, wetting behavior and electrical resistivity of the solders were evaluated. According to the results, by adding graphene nanosheets, the wetting angle of the solder first decreased and then increased. This parameter showed the optimal amount for sample containing ۰.۱% graphene nanosheets with a ۱۰% reduction. The melting point and electrical resistance of the solder alloy did not change significantly with compositing. With the addition of graphene nanosheets, the thickness of the intermetallic compounds Cu۶Sn۵ present at the interface between copper and solder wasreduced up to ۳۰%

کلیدواژه ها

Lead free solder, Graphene nanosheets, Intermetallic compounds, Physical Properties, Wetting.

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