Mechanical behavior of Sn-Cu-Bi-xCr (x= ۰ and ۰.۰۱ wt.%) lead-free solder: numerical and experimental studies

Solders as connecting materials play a key role in joints and assemblies in the infinite world of electronics. Following the elimination usage of Sn-Pb solder from electronicapplications according to the Europe legislation in ۲۰۰۶, lead-free solders were introduced. One of the important factors in choosing the alternative solder is mechanical properties because the solder is subject to stress and strain when an electronic device is operating, or in some environments, the solder is exposed to significant vibrations and tensile forces. So tensile properties are important factors that determine the deformation range of solders with the non-failure condition. In this paper, a comparative study in terms of experimental and simulation has been done on the addition of Cr along with Bi as one of the important alloying elements to the low-cost Sn-Cu solder. The effect of adding Cr on the tensile properties of the new Sn-۰.۸Cu-۱.۸Bi-xCr (x = ۰ and ۰.۰۱) is studied. ABAQUS software was used to simulate the tension behavior and the used method to simulate the mechanical behavior of solders was verified by the experimental results and complements each other. The results showed the improvement in mechanical behavior by alloying and probable mechanisms such as precipitation hardening, the formation of a solid solution, and presence of dislocations in microstructures. The conformity of numerical and experimental results is higher than ۸۵% and the biggest and smallest simulation/experimental differences were in young modulus and yield stress values, respectively.

کلیدواژه ها:

lead-free solders ، tensile ، simulation ، ABAQUS ، precipitation hardening ، solid solution