Development of Cu-Sn alloy electroplating in the non-cyanide alkaline electrolyte

Cu-Sn alloys have excellent properties such as high corrosion resistance, ductility and decorative application. However, the main baths which are used for Cu-Sn alloys electrodeposition has cyanide’s in the electrolyte. These compositions have been encountered enormous challenges especially in terms of high cost industrial wastewater treatment. In contrast to cyanide baths, a non-cyanide Cu–Sn plating bath containing sorbitol as ligand which has the advantages of low toxicity and relative ease of handling, has been developed. SEM analysis showed compact morphology and the coating had the grain size lower than 100 nm. The obtained films were smooth and covered the substrate completely. EDS of Cu–Sn films showed that the deposits had a maximum of 8 wt% Sn. Corrosion resistance of coatings has been studied in 3.5% NaCl solution. The results showed that by increasing the Sn content, an improvement in the corrosion resistance of the Cu-Sn coating has been observed.

کلیدواژه ها:

Alloy Electroplating ، Cu-Sn Alloy ، Non Cyanide Baths ، Sorbitol